John Holmblad a écrit : > http://www.smta.org/files/CTEA_High_Density_Pkg_Trends-Carey-Portelligent.pdf > > You can see, from viewing the iphone PCB discussed on pp 13-17 of that > presentation. that, in addition to having separate power amps for each > of 3 frequency band groupings (it is a quad band device). the device > also has a Multi-chip package (MCP) to handle both a GSM/EDGE chip as > well as a WCDMA chip needed for 3g baseband processing. I could foresee > that another designer, with an application that did not require 2G > "backward compatibility", might :design out: the 2G chip ( "hold the > 2g" if you will) in order to save space and power in the design. This, > however, would make the device un-useable in a network that was not 100% > 3G/UMTS, UNLESS the device was being used ONLY for non-voice data access > and not for "traditional" voice. John, Nokia will more likely use this kind of integration: http://www.phonewreck.com/wiki/index.php?title=Nokia_N95#Block_Diagram The Quad-band GSM/GPRS/EDGE + Dual-band UMTS/HSPDA chain use 1 chip for the baseband, 1 chip for the transceiver and 1 chip for the amplifier. Best Regards, -- Jean-Christian de Rivaz _______________________________________________ maemo-users mailing list maemo-users@xxxxxxxxx https://lists.maemo.org/mailman/listinfo/maemo-users
