Re: [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support

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On 02/10/2023 16:00, Dmitry Baryshkov wrote:
> On Mon, 2 Oct 2023 at 17:52, Manivannan Sadhasivam <mani@xxxxxxxxxx> wrote:
>>
>> On Sun, Oct 01, 2023 at 06:26:14PM +0100, Caleb Connolly wrote:
>>>
>>>
>>> On 01/10/2023 16:57, Manivannan Sadhasivam wrote:
>>>> On Fri, Sep 29, 2023 at 05:16:16PM +0100, Caleb Connolly wrote:
>>>>> The Thermal Mitigation Device (TMD) Service is a QMI service that runs
>>>>> on remote subsystems (the modem and DSPs) on Qualcomm SoCs.
>>>>> It exposes various mitigations including passive thermal controls and
>>>>> rail voltage restrictions.
>>>>>
>>>>> This series introduces support for exposing TMDs as cooling devices
>>>>> in the kernel through the thermal framework, using the QMI interface.
>>>>>
>>>>> Each TMD client is described as a child of the remoteproc node in
>>>>> devicetree. With subnodes for each control.
>>>>>
>>>>
>>>> Daniel expressed concerns in the past aganist representing TMD driver as a
>>>> cooling device since it is not tied to thermal zones and the governors cannot
>>>> use it. Instead he suggested to represent it as a powercap device with thermal
>>>> constraints.

I think so, see for example in CAF 4.9 [1]

As far as I can tell, the QMI TMD service was written specifically *for*
the cooling_device API, so it's a bit of a chicken and egg problem
trying to coerce it to some other form...

That all being said, I can definitely see the potential value in using
the powercap framework. Especially if it would let us tie the TMD
controls more directly with the remoteproc device and more easily
integrate it with DTPM.

For example, would it also make sense to adjust these values to preserve
battery life? Which API makes the most sense for that?

[1]:
https://github.com/android-linux-stable/msm-4.9/blob/384eee701481c3dd08822819cf4d5f1da5729db1/arch/arm64/boot/dts/qcom/sdm670-thermal.dtsi#L661
>>>
>>> Hi Mani,
>>>
>>> Forgive me as I'm not yet super familiar with the thermal subsystem.
>>>
>>> As I understand it, the DT layout here enables each control to be referenced
>>> under the thermal zones, at least this is the approach taken in CAF 4.9.
>>>
>>> Maybe I don't quite understand what you mean, are you saying that using
>>> thermal zones is the wrong approach?
>>
>> Thermal framework expects each thermal zone represented in DT to have atleast
>> one corresponding thermal sensor defined using "thermal-sensors" property. But
>> with TMD, there is no thermal sensor AFAIK.
> 
> As far as I understand, no. It is perfectly fine to have 'cooling'
> devices, which react to external thermal monitoring events. I might be
> mistaken, but I think that is the case here, isn't it?
> 
>>
>>>>
>>>> So please look into that approach.
>>>
>>> Any recommended reading? Or drivers I can use as a reference?
>>>
>>
>> drivers/powercap/arm_scmi_powercap.c seems to be a good reference.
>>
>> - Mani
>>
>>> Thanks
>>>>
>>>> - Mani
>>>>
>>>>> This series is based on previous work by Bhupesh Sharma which can be
>>>>> found at [1]. I'm sending this as a fresh series as it has been a
>>>>> year since the original version and I have rewritten most of the driver.
>>>>>
>>>>> [1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@xxxxxxxxxx/
>>>>>
>>>>> ---
>>>>> Caleb Connolly (4):
>>>>>        remoteproc: qcom: probe all child devices
>>>>>        dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings
>>>>>        thermal: qcom: add qmi-cooling driver
>>>>>        MAINTAINERS: Add entry for Qualcomm Cooling Driver
>>>>>
>>>>>   .../bindings/remoteproc/qcom,msm8996-mss-pil.yaml  |  13 +
>>>>>   .../bindings/remoteproc/qcom,pas-common.yaml       |   6 +
>>>>>   .../bindings/thermal/qcom,qmi-cooling.yaml         | 168 +++++++
>>>>>   MAINTAINERS                                        |   8 +
>>>>>   drivers/remoteproc/qcom_q6v5.c                     |   4 +
>>>>>   drivers/remoteproc/qcom_q6v5_mss.c                 |   8 -
>>>>>   drivers/thermal/qcom/Kconfig                       |  13 +
>>>>>   drivers/thermal/qcom/Makefile                      |   1 +
>>>>>   drivers/thermal/qcom/qmi-cooling.c                 | 520 +++++++++++++++++++++
>>>>>   drivers/thermal/qcom/qmi-cooling.h                 | 428 +++++++++++++++++
>>>>>   10 files changed, 1161 insertions(+), 8 deletions(-)
>>>>> ---
>>>>> base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812
>>>>>
>>>>> // Caleb (they/them)
>>>>>
>>>>
>>>
>>> --
>>> // Caleb (they/them)
>>
>> --
>> மணிவண்ணன் சதாசிவம்
> 
> 
> 

-- 
// Caleb (they/them)



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