The Thermal Mitigation Device (TMD) Service is a QMI service that runs on remote subsystems (the modem and DSPs) on Qualcomm SoCs. It exposes various mitigations including passive thermal controls and rail voltage restrictions. This series introduces support for exposing TMDs as cooling devices in the kernel through the thermal framework, using the QMI interface. Each TMD client is described as a child of the remoteproc node in devicetree. With subnodes for each control. This series is based on previous work by Bhupesh Sharma which can be found at [1]. I'm sending this as a fresh series as it has been a year since the original version and I have rewritten most of the driver. [1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@xxxxxxxxxx/ --- Caleb Connolly (4): remoteproc: qcom: probe all child devices dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings thermal: qcom: add qmi-cooling driver MAINTAINERS: Add entry for Qualcomm Cooling Driver .../bindings/remoteproc/qcom,msm8996-mss-pil.yaml | 13 + .../bindings/remoteproc/qcom,pas-common.yaml | 6 + .../bindings/thermal/qcom,qmi-cooling.yaml | 168 +++++++ MAINTAINERS | 8 + drivers/remoteproc/qcom_q6v5.c | 4 + drivers/remoteproc/qcom_q6v5_mss.c | 8 - drivers/thermal/qcom/Kconfig | 13 + drivers/thermal/qcom/Makefile | 1 + drivers/thermal/qcom/qmi-cooling.c | 520 +++++++++++++++++++++ drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++ 10 files changed, 1161 insertions(+), 8 deletions(-) --- base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812 // Caleb (they/them)
