On Fri, Sep 29, 2023 at 05:16:16PM +0100, Caleb Connolly wrote: > The Thermal Mitigation Device (TMD) Service is a QMI service that runs > on remote subsystems (the modem and DSPs) on Qualcomm SoCs. > It exposes various mitigations including passive thermal controls and > rail voltage restrictions. > > This series introduces support for exposing TMDs as cooling devices > in the kernel through the thermal framework, using the QMI interface. > > Each TMD client is described as a child of the remoteproc node in > devicetree. With subnodes for each control. > Daniel expressed concerns in the past aganist representing TMD driver as a cooling device since it is not tied to thermal zones and the governors cannot use it. Instead he suggested to represent it as a powercap device with thermal constraints. So please look into that approach. - Mani > This series is based on previous work by Bhupesh Sharma which can be > found at [1]. I'm sending this as a fresh series as it has been a > year since the original version and I have rewritten most of the driver. > > [1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@xxxxxxxxxx/ > > --- > Caleb Connolly (4): > remoteproc: qcom: probe all child devices > dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings > thermal: qcom: add qmi-cooling driver > MAINTAINERS: Add entry for Qualcomm Cooling Driver > > .../bindings/remoteproc/qcom,msm8996-mss-pil.yaml | 13 + > .../bindings/remoteproc/qcom,pas-common.yaml | 6 + > .../bindings/thermal/qcom,qmi-cooling.yaml | 168 +++++++ > MAINTAINERS | 8 + > drivers/remoteproc/qcom_q6v5.c | 4 + > drivers/remoteproc/qcom_q6v5_mss.c | 8 - > drivers/thermal/qcom/Kconfig | 13 + > drivers/thermal/qcom/Makefile | 1 + > drivers/thermal/qcom/qmi-cooling.c | 520 +++++++++++++++++++++ > drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++ > 10 files changed, 1161 insertions(+), 8 deletions(-) > --- > base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812 > > // Caleb (they/them) > -- மணிவண்ணன் சதாசிவம்
