On Sun, Oct 01, 2023 at 06:26:14PM +0100, Caleb Connolly wrote: > > > On 01/10/2023 16:57, Manivannan Sadhasivam wrote: > > On Fri, Sep 29, 2023 at 05:16:16PM +0100, Caleb Connolly wrote: > > > The Thermal Mitigation Device (TMD) Service is a QMI service that runs > > > on remote subsystems (the modem and DSPs) on Qualcomm SoCs. > > > It exposes various mitigations including passive thermal controls and > > > rail voltage restrictions. > > > > > > This series introduces support for exposing TMDs as cooling devices > > > in the kernel through the thermal framework, using the QMI interface. > > > > > > Each TMD client is described as a child of the remoteproc node in > > > devicetree. With subnodes for each control. > > > > > > > Daniel expressed concerns in the past aganist representing TMD driver as a > > cooling device since it is not tied to thermal zones and the governors cannot > > use it. Instead he suggested to represent it as a powercap device with thermal > > constraints. > > Hi Mani, > > Forgive me as I'm not yet super familiar with the thermal subsystem. > > As I understand it, the DT layout here enables each control to be referenced > under the thermal zones, at least this is the approach taken in CAF 4.9. > > Maybe I don't quite understand what you mean, are you saying that using > thermal zones is the wrong approach? Thermal framework expects each thermal zone represented in DT to have atleast one corresponding thermal sensor defined using "thermal-sensors" property. But with TMD, there is no thermal sensor AFAIK. > > > > So please look into that approach. > > Any recommended reading? Or drivers I can use as a reference? > drivers/powercap/arm_scmi_powercap.c seems to be a good reference. - Mani > Thanks > > > > - Mani > > > > > This series is based on previous work by Bhupesh Sharma which can be > > > found at [1]. I'm sending this as a fresh series as it has been a > > > year since the original version and I have rewritten most of the driver. > > > > > > [1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@xxxxxxxxxx/ > > > > > > --- > > > Caleb Connolly (4): > > > remoteproc: qcom: probe all child devices > > > dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings > > > thermal: qcom: add qmi-cooling driver > > > MAINTAINERS: Add entry for Qualcomm Cooling Driver > > > > > > .../bindings/remoteproc/qcom,msm8996-mss-pil.yaml | 13 + > > > .../bindings/remoteproc/qcom,pas-common.yaml | 6 + > > > .../bindings/thermal/qcom,qmi-cooling.yaml | 168 +++++++ > > > MAINTAINERS | 8 + > > > drivers/remoteproc/qcom_q6v5.c | 4 + > > > drivers/remoteproc/qcom_q6v5_mss.c | 8 - > > > drivers/thermal/qcom/Kconfig | 13 + > > > drivers/thermal/qcom/Makefile | 1 + > > > drivers/thermal/qcom/qmi-cooling.c | 520 +++++++++++++++++++++ > > > drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++ > > > 10 files changed, 1161 insertions(+), 8 deletions(-) > > > --- > > > base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812 > > > > > > // Caleb (they/them) > > > > > > > -- > // Caleb (they/them) -- மணிவண்ணன் சதாசிவம்
