Re: [PATCH 0/2] Update OF thermal properties for cooling-{min,max}-level

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Punit Agrawal <punit.agrawal@xxxxxxx> writes:

> Hi,
>
> The device tree properties regarding the specification and usage of
> states for cooling devices suffer from inconsistency in the bindings
> as well as the usage.
>
> The two patches here update the bindings to be consistent without
> breaking existing support for the device trees already in upstream.
>

Gentle reminder to request review of the below two patches!

> Thanks,
> Punit
>
> Punit Agrawal (2):
>   of: thermal: Fix inconsitency between cooling-*-state and
>     cooling-*-level
>   of: thermal: Mark cooling-*-level properties optional
>
>  .../devicetree/bindings/thermal/thermal.txt        | 27 +++++++++++-----------
>  1 file changed, 14 insertions(+), 13 deletions(-)
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