Re: [PATCH 0/2] Update OF thermal properties for cooling-{min,max}-level

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On 09/08/2015 06:16 AM, Punit Agrawal wrote:
> Hi,
> 
> The device tree properties regarding the specification and usage of
> states for cooling devices suffer from inconsistency in the bindings
> as well as the usage.
> 
> The two patches here update the bindings to be consistent without
> breaking existing support for the device trees already in upstream.
> 
> Thanks,
> Punit
> 
> Punit Agrawal (2):
>   of: thermal: Fix inconsitency between cooling-*-state and
>     cooling-*-level
>   of: thermal: Mark cooling-*-level properties optional

Applied, thanks.

Rob

> 
>  .../devicetree/bindings/thermal/thermal.txt        | 27 +++++++++++-----------
>  1 file changed, 14 insertions(+), 13 deletions(-)
> 

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