Re: [PATCH 0/3] Thermal extensions for flexibility in cooling device bindings

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Hi Daniel,

On 3/13/20 1:33 PM, Daniel Lezcano wrote:

Hi Lukasz,

On 16/12/2019 15:06, lukasz.luba@xxxxxxx wrote:
From: Lukasz Luba <lukasz.luba@xxxxxxx>

Hi all,

This patch set adds extensions to existing thermal zones and cooling devices
binding. Currently they are pinned using static definitions e.g. DT cooling
maps. These changes enable userspace like trusted middleware to change the
layout of cooling maps unbinding and binding the cooling devices.
It might be helpful for drivers loaded as a modules. They can be added to
existing thermal zones to take part of the power split.
It is based on the current work in thermal branch thermal/linux-next
https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next

I've been keeping this series out of the previous merge because it did
not raise any comments and we are touching the sysfs.

For this release, I still don't know what to do with it.

Thank you for bringing this back.


Anyone a comment on this series? Rui ?


Regards,
Lukasz



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