Hi Lukasz, On 16/12/2019 15:06, lukasz.luba@xxxxxxx wrote: > From: Lukasz Luba <lukasz.luba@xxxxxxx> > > Hi all, > > This patch set adds extensions to existing thermal zones and cooling devices > binding. Currently they are pinned using static definitions e.g. DT cooling > maps. These changes enable userspace like trusted middleware to change the > layout of cooling maps unbinding and binding the cooling devices. > It might be helpful for drivers loaded as a modules. They can be added to > existing thermal zones to take part of the power split. > It is based on the current work in thermal branch thermal/linux-next > https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next I've been keeping this series out of the previous merge because it did not raise any comments and we are touching the sysfs. For this release, I still don't know what to do with it. Anyone a comment on this series? Rui ? > Lukasz Luba (3): > docs: thermal: Add bind, unbind information together with trip point > thermal: Make cooling device trip point writable from sysfs > thermal: Add sysfs binding for cooling device and thermal zone > > .../driver-api/thermal/sysfs-api.rst | 30 +++++++- > drivers/thermal/thermal_core.c | 3 +- > drivers/thermal/thermal_core.h | 2 + > drivers/thermal/thermal_sysfs.c | 77 +++++++++++++++++++ > 4 files changed, 109 insertions(+), 3 deletions(-) > -- <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | <http://twitter.com/#!/linaroorg> Twitter | <http://www.linaro.org/linaro-blog/> Blog
