From: Lukasz Luba <lukasz.luba@xxxxxxx> Hi all, This patch set adds extensions to existing thermal zones and cooling devices binding. Currently they are pinned using static definitions e.g. DT cooling maps. These changes enable userspace like trusted middleware to change the layout of cooling maps unbinding and binding the cooling devices. It might be helpful for drivers loaded as a modules. They can be added to existing thermal zones to take part of the power split. It is based on the current work in thermal branch thermal/linux-next https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next Regards, Lukasz Luba Lukasz Luba (3): docs: thermal: Add bind, unbind information together with trip point thermal: Make cooling device trip point writable from sysfs thermal: Add sysfs binding for cooling device and thermal zone .../driver-api/thermal/sysfs-api.rst | 30 +++++++- drivers/thermal/thermal_core.c | 3 +- drivers/thermal/thermal_core.h | 2 + drivers/thermal/thermal_sysfs.c | 77 +++++++++++++++++++ 4 files changed, 109 insertions(+), 3 deletions(-) -- 2.17.1
