On Tue, Nov 21, 2023 at 04:04:03PM +0100, Johan Hovold wrote: > On Tue, Nov 21, 2023 at 03:21:34PM +0100, Greg Kroah-Hartman wrote: > > On Mon, Nov 20, 2023 at 05:53:10PM +0100, Johan Hovold wrote: > > > On Mon, Nov 20, 2023 at 09:22:54AM -0600, Andrew Halaney wrote: > > > > On Sat, Nov 18, 2023 at 12:47:30AM +0100, Konrad Dybcio wrote: > > > > > On 17.11.2023 18:36, Johan Hovold wrote: > > > > > > When reviewing the recently submitted series which reworks the dwc3 qcom > > > > > > glue implementation [1], I noticed that the driver's tear down handling > > > > > > is currently broken, something which can lead to memory leaks and > > > > > > potentially use-after-free issues on probe deferral and on driver > > > > > > unbind. > > > > > > > > > > > > Let's get this sorted before reworking driver. > > > > > > > > > > > > Note that the last patch has only been compile tested as I don't have > > > > > > access to a sdm845 device. > > > > > > > > I'll sound like a broken record, but: > > > > > > > > > > is there anyone in the world that is actively benefiting from this failed > > > > > experiment of using the ACPI tables that were shipped with these SoCs? > > > > I agree that if we can remove the ACPI hacks in here, we should try do > > > so (e.g. given that no one really uses it anymore). > > > > > > As Andrew already mentioned, that is a separate issue not directly > > > related to this series, though. > > > > > > Removing it before reworking the dwc3 binding [1] and adding multiport > > > support [2] should simplify both of those series quite a bit, however. > > > > [1] https://lore.kernel.org/all/20231016-dwc3-refactor-v1-0-ab4a84165470@xxxxxxxxxxx/ > > > [2] https://lore.kernel.org/all/20231007154806.605-1-quic_kriskura@xxxxxxxxxxx/ > > > > > > > So should I apply this series now or not? > > Please do. Removing ACPI support should be done later if that's at all > possible. Great, now queued up, thanks. greg k-h
