When reviewing the recently submitted series which reworks the dwc3 qcom glue implementation [1], I noticed that the driver's tear down handling is currently broken, something which can lead to memory leaks and potentially use-after-free issues on probe deferral and on driver unbind. Let's get this sorted before reworking driver. Note that the last patch has only been compile tested as I don't have access to a sdm845 device. Johan [1] https://lore.kernel.org/lkml/20231016-dwc3-refactor-v1-0-ab4a84165470@xxxxxxxxxxx/ Johan Hovold (3): USB: dwc3: qcom: fix resource leaks on probe deferral USB: dwc3: qcom: fix software node leak on probe errors USB: dwc3: qcom: fix ACPI platform device leak drivers/usb/dwc3/dwc3-qcom.c | 57 +++++++++++++++++++++++++++--------- 1 file changed, 43 insertions(+), 14 deletions(-) -- 2.41.0
