On Sat, Nov 18, 2023 at 12:47:30AM +0100, Konrad Dybcio wrote: > On 17.11.2023 18:36, Johan Hovold wrote: > > When reviewing the recently submitted series which reworks the dwc3 qcom > > glue implementation [1], I noticed that the driver's tear down handling > > is currently broken, something which can lead to memory leaks and > > potentially use-after-free issues on probe deferral and on driver > > unbind. > > > > Let's get this sorted before reworking driver. > > > > Note that the last patch has only been compile tested as I don't have > > access to a sdm845 device. > > > > Johan > I'll sound like a broken record, but: > > is there anyone in the world that is actively benefiting from this failed > experiment of using the ACPI tables that were shipped with these SoCs? > > There are so so so many shortcomings associated with it due to how Windows > drivers on these platforms know waaaay too much and largely use ACPI to > "bind driver x" and I simply think it doesn't make sense to continue > carrying this code forward given little use and no testing. > > Konrad > For what it is worth, I have agreed with your opinion on this every time I've read it. I am not the target audience of the question, but I'll at least give my personal (interpreted: uneducated? undesired?) opinion that the ACPI support in here adds little value and extra burden. Of course that topic is a bit independent of this series, but I'd be curious if a patchset removing the support would be welcomed or not by maintainers, so I'm stirring the pot by replying here :) Thanks, Andrew
