On 24/10/2023 12:57, Zhenhua Huang wrote: > > > On 2023/10/23 20:52, Krzysztof Kozlowski wrote: >> On 23/10/2023 13:54, Zhenhua Huang wrote: >>> >>> >>> On 2023/10/23 17:27, Krzysztof Kozlowski wrote: >>>> On 23/10/2023 11:20, Zhenhua Huang wrote: >>>>> Add bindings for the QCOM Memory Dump driver providing debug >>>> >>>> Bindings are for hardware, not driver. This suggests it is not suitable >>>> for bindings at all. >>>> >>>>> facilities. Firmware dumps system cache, internal memory, >>>>> peripheral registers to reserved DDR as per the table which >>>>> populated by the driver, after crash and warm reset. >>>> >>>> Again driver :/ >>> >>> Thanks for pointing out. Qualcomm memory dump device is a reserved >>> memory region which is used to communicate with firmware. I will update >>> description in next version. >> >> I have still doubts that it is suitable for DT. I usually expect such >> firmware feature-drivers to be instantiated by existing firmware >> drivers. You do not need DT for this. > > Got it, as it interacts with firmware, you think it should be a firmware > driver? But it seems there should not be existing suitable place to put > it now(qcom_scm.c is for TZ). Shall we create one new file like > *qcom_sdi.c* in drivers/firmware and put it there? Because SDI(system > debug image, which is part of bootloader) is the firmware doing the things. Dunno, didn't think about this. I comment here only about bindings. This does not look suitable for bindings. That's it. Best regards, Krzysztof
