Re: [PATCH v1 1/5] dt-bindings: soc: qcom: Add memory_dump driver bindings

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On 2023/10/23 20:52, Krzysztof Kozlowski wrote:
On 23/10/2023 13:54, Zhenhua Huang wrote:


On 2023/10/23 17:27, Krzysztof Kozlowski wrote:
On 23/10/2023 11:20, Zhenhua Huang wrote:
Add bindings for the QCOM Memory Dump driver providing debug

Bindings are for hardware, not driver. This suggests it is not suitable
for bindings at all.

facilities. Firmware dumps system cache, internal memory,
peripheral registers to reserved DDR as per the table which
populated by the driver, after crash and warm reset.

Again driver :/

Thanks for pointing out. Qualcomm memory dump device is a reserved
memory region which is used to communicate with firmware. I will update
description in next version.

I have still doubts that it is suitable for DT. I usually expect  such
firmware feature-drivers to be instantiated by existing firmware
drivers. You do not need DT for this.

Got it, as it interacts with firmware, you think it should be a firmware driver? But it seems there should not be existing suitable place to put it now(qcom_scm.c is for TZ). Shall we create one new file like *qcom_sdi.c* in drivers/firmware and put it there? Because SDI(system debug image, which is part of bootloader) is the firmware doing the things.


Best regards,
Krzysztof




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