On 28/09/2023 12:38, Rafael J. Wysocki wrote:
On Thu, Sep 28, 2023 at 9:10 AM Daniel Lezcano
<daniel.lezcano@xxxxxxxxxx> wrote:
On 21/09/2023 20:01, Rafael J. Wysocki wrote:
From: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx>
Add new helper functions, thermal_bind_cdev_to_trip() and
thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for
binding a cooling device to a trip point and unbinding it, respectively,
and redefine the existing helpers, thermal_zone_bind_cooling_device()
and thermal_zone_unbind_cooling_device(), as wrappers around the new
ones, respectively.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx>
---
Reviewed-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxx>
Thanks so much for all of the reviews!
You are welcome. Thanks for cleaning up the ACPI code
I'll now apply the patches for which you have given tags and respin
the rest (governor changes) as a separate series on top of them.
Sounds good, thanks
--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs
Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog
