On 21/09/2023 20:01, Rafael J. Wysocki wrote:
From: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx> Add new helper functions, thermal_bind_cdev_to_trip() and thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for binding a cooling device to a trip point and unbinding it, respectively, and redefine the existing helpers, thermal_zone_bind_cooling_device() and thermal_zone_unbind_cooling_device(), as wrappers around the new ones, respectively. No intentional functional impact. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx> ---
Reviewed-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxx> -- <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | <http://twitter.com/#!/linaroorg> Twitter | <http://www.linaro.org/linaro-blog/> Blog
