On Thu, Sep 28, 2023 at 9:10 AM Daniel Lezcano <daniel.lezcano@xxxxxxxxxx> wrote: > > On 21/09/2023 20:01, Rafael J. Wysocki wrote: > > From: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx> > > > > Add new helper functions, thermal_bind_cdev_to_trip() and > > thermal_unbind_cdev_from_trip(), to allow a trip pointer to be used for > > binding a cooling device to a trip point and unbinding it, respectively, > > and redefine the existing helpers, thermal_zone_bind_cooling_device() > > and thermal_zone_unbind_cooling_device(), as wrappers around the new > > ones, respectively. > > > > No intentional functional impact. > > > > Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx> > > --- > > Reviewed-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxx> Thanks so much for all of the reviews! I'll now apply the patches for which you have given tags and respin the rest (governor changes) as a separate series on top of them.
