Re: [PATCH v2] arm64: dts: rockchip: enable built-in thermal monitoring on rk3588

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Hi Alexey,


On 21/01/2024 20:57, Alexey Charkov wrote:
On Fri, Jan 19, 2024 at 8:21 PM Daniel Lezcano
<daniel.lezcano@xxxxxxxxxx> wrote:
Hello Daniel,

Thanks a lot for your review and comments! Please see some reflections below.

On 09/01/2024 20:19, Alexey Charkov wrote:
Include thermal zones information in device tree for rk3588 variants
and enable the built-in thermal sensing ADC on RADXA Rock 5B

Signed-off-by: Alexey Charkov <alchark@xxxxxxxxx>
---
Changes in v2:
   - Dropped redundant comments
   - Included all CPU cores in cooling maps
   - Split cooling maps into more granular ones utilizing TSADC
     channels 1-3 which measure temperature by separate CPU clusters
     instead of channel 0 which measures the center of the SoC die
---
   .../boot/dts/rockchip/rk3588-rock-5b.dts      |   4 +
   arch/arm64/boot/dts/rockchip/rk3588s.dtsi     | 151 ++++++++++++++++++
   2 files changed, 155 insertions(+)

diff --git a/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts b/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
index a5a104131403..f9d540000de3 100644
--- a/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
+++ b/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
@@ -772,3 +772,7 @@ &usb_host1_ehci {
   &usb_host1_ohci {
       status = "okay";
   };
+
+&tsadc {
+     status = "okay";
+};
diff --git a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
index 8aa0499f9b03..8d54998d0ecc 100644
--- a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
+++ b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
@@ -10,6 +10,7 @@
   #include <dt-bindings/reset/rockchip,rk3588-cru.h>
   #include <dt-bindings/phy/phy.h>
   #include <dt-bindings/ata/ahci.h>
+#include <dt-bindings/thermal/thermal.h>

   / {
       compatible = "rockchip,rk3588";
@@ -2112,6 +2113,156 @@ tsadc: tsadc@fec00000 {
               status = "disabled";
       };

+     thermal_zones: thermal-zones {
+             /* sensor near the center of the whole chip */
+             soc_thermal: soc-thermal {
+                     polling-delay-passive = <20>;

There is no mitigation set for this thermal zone. It is pointless to
specify a passive polling.

Indeed, it makes sense to me. There seems to be a catch though in that
the driver calls the generic thermal_of_zone_register during the
initial probe, which expects both of those polling delays to be
present in the device tree, otherwise it simply refuses to add the
respective thermal zone, see drivers/thermal/thermal_of.c:502

Usually:

polling-delay-passive = <0>;
polling-delay = <0>;

cf:

git grep "polling-delay = <0>" arch/arm64/boot/dts

+                     polling-delay = <1000>;

The driver is interrupt driven. No need to poll.

Same here as above

+                     sustainable-power = <2100>;

There is no mitigation with this thermal zone. Specifying a sustainable
power does not make sense.

Thanks, will drop this in v3!

+                     thermal-sensors = <&tsadc 0>;
+
+                     trips {
+                             soc_crit: soc-crit {
+                                     temperature = <115000>;
+                                     hysteresis = <2000>;

This trip point leads to a system shutdown / reboot. It is not necessary
to specify a hysteresis.

Similar to the above, the generic thermal_of code refuses to add the
trip point if it has no hysteresis property defined (regardless of the
trip type), see drivers/thermal/thermal_of.c:109

hysteresis = <0>;


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