Re: [PATCH v2 05/11] dt-bindings: thermal: k3-j72xx: elaborate on binding description

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Subject: Re: [PATCH v2 05/11] dt-bindings: thermal: k3-j72xx: elaborate on binding description
From: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx>
Date: Wed, 26 Oct 2022 10:54:43 -0400
Cc: Keerthy <j-keerthy@xxxxxx>, Linux PM <linux-pm@xxxxxxxxxxxxxxx>, Device Trees <devicetree@xxxxxxxxxxxxxxx>, LKML <linux-kernel@xxxxxxxxxxxxxxx>, LKML ARM <linux-arm-kernel@xxxxxxxxxxxxxxxxxxx>
In-reply-to: <20221025191515.9151-6-bb@ti.com>
User-agent: Mozilla/5.0 (X11; Linux x86_64; rv:102.0) Gecko/20100101 Thunderbird/102.4.0

On 25/10/2022 15:15, Bryan Brattlof wrote:
> Elaborate on the function of this device node as well as some of the
> properties this node uses.
> 
> Signed-off-by: Bryan Brattlof <bb@xxxxxx>
> ---


Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@xxxxxxxxxx>

Best regards,
Krzysztof

References:
- [PATCH v2 00/11] enable VTM node for all TI's K3 SoCs
  - From: Bryan Brattlof
- [PATCH v2 05/11] dt-bindings: thermal: k3-j72xx: elaborate on binding description
  - From: Bryan Brattlof

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