Hello all, As you noticed, I am working in a way to represent thermal data using device tree [1]. Essentially, this should be a way to say what to do with a sensor and how to associate (cooling) actions with it. The motivation to create such infrastructure is: (i) - to reuse the existing temperature sensor code base; (ii) - have a way to easily describe thermal data across different boards for the same sensor. Say you have an i2c temp sensor, which is placed close to your battery on board A but on board B, another instance of this same senor is placed close to your display, for instance. This series introduces then a DT parser. The data expected in DT must contain the needed properties to build a thermal zone out of the desired sensor. All properties are documented and they are derived from the existing requirements of current thermal API. In order to perform a binding with cooling devices, the new thermal zone built using DT nodes will use the existing thermal API that uses binding parameters. This is the current proposed way to register thermal zones with platform information, written by Durga. There are some virtual concepts that are pushed to device tree, I know. But I believe using device tree to do this makes sense because we are still describing the HW and how they are related to each other. Things like cooling devices are not represented in device tree though, as I believe that will cause a lot of confusion with real devices (as already does). So the series is short but I think it makes sense to describe how it is organized, as it touches several places. First four patches are a preparation for this parser. There is a change on cpufreq-cpu0, so that it knows now how to load its corresponding cooling device. There is a change on thermal_core to split its hwmon code, because I think we may need to improve this code base when we start to integrate better with hwmon temperature sensors. Then, another needed preparation is to improve the bind_params, so that we are able to bind with upper and lower limits. The remaining patches are the changes with the proposed DT parser. A part from the DT thermal zone builder itself (patch 05), I also changed the ti-soc-thermal driver to use this new API and the omap4430 bandgap DT node, as an example (this has been tested on panda omap4430); and also changed the hwmon drivers lm75 and tmp102 to have the option to build a thermal zone using DT. I haven't touched any dts file using lm75 or tmp102 because this should come on a need basis. I believe this code is pretty usable the way it is, but might need to be revisited, in case the enhancement proposed by Durga get in. This is because representing virtual thermal zones built out of several sensors may need a different representation in DT. [1] - RFC of this work: http://comments.gmane.org/gmane.linux.power-management.general/35874 Changes from RFC: - Added a way to load cpufreq cooling device out of DT - Added a way to bind with upper and lower limits using bind_params - Added a way to specify upper and lower binding limits on DT - Added DT thermal builder support to lm75 and tmp102 hwmon drivers - Changed ERANGE to EDOM - Added thermal constants for zone type and bind limit, so that dts file could be more readable Tested on panda omap4430 (3.11-rc1 with minor changes for getting cpufreq working) BR, Eduardo Valentin (9): cpufreq: cpufreq-cpu0: add dt node parsing for 'needs-cooling' thermal: hwmon: move hwmon support to single file thermal: thermal_core: allow binding with limits on bind_params arm: dts: flag omap4430 with needs-cooling for cpu node thermal: introduce device tree parser thermal: ti-soc-thermal: use thermal DT infrastructure arm: dts: add omap4430 thermal data hwmon: lm75: expose to thermal fw via DT nodes hwmon: tmp102: expose to thermal fw via DT nodes .../devicetree/bindings/cpufreq/cpufreq-cpu0.txt | 3 + .../devicetree/bindings/thermal/thermal.txt | 133 ++++++ Documentation/thermal/sysfs-api.txt | 7 + arch/arm/boot/dts/omap443x.dtsi | 32 +- drivers/cpufreq/cpufreq-cpu0.c | 8 + drivers/hwmon/lm75.c | 29 ++ drivers/hwmon/tmp102.c | 25 ++ drivers/thermal/Kconfig | 22 + drivers/thermal/Makefile | 4 + drivers/thermal/thermal_core.c | 274 +----------- drivers/thermal/thermal_dt.c | 458 +++++++++++++++++++++ drivers/thermal/thermal_hwmon.c | 269 ++++++++++++ drivers/thermal/thermal_hwmon.h | 49 +++ drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 46 ++- include/dt-bindings/thermal/thermal.h | 27 ++ include/linux/thermal.h | 13 + 16 files changed, 1129 insertions(+), 270 deletions(-) create mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt create mode 100644 drivers/thermal/thermal_dt.c create mode 100644 drivers/thermal/thermal_hwmon.c create mode 100644 drivers/thermal/thermal_hwmon.h create mode 100644 include/dt-bindings/thermal/thermal.h -- 1.8.2.1.342.gfa7285d _______________________________________________ lm-sensors mailing list lm-sensors@xxxxxxxxxxxxxx http://lists.lm-sensors.org/mailman/listinfo/lm-sensors
