On Tue, Mar 26, 2013 at 03:06:59PM +0800, Hongbo Zhang wrote: > Each of ST-Ericsson X500 chip set series consists of both ABX500 and DBX500 > chips. This is ABX500 hwmon driver, where the abx500.c is a common layer for > all ABX500s, and the ab8500.c is specific for AB8500 chip. Under this designed > structure, other chip specific files can be added simply using the same common > layer abx500.c. > > Signed-off-by: Hongbo Zhang <hongbo.zhang@xxxxxxxxxx> Looks good except ... > diff --git a/drivers/power/ab8500_bmdata.c b/drivers/power/ab8500_bmdata.c > index d9f1f25..05a1077 100644 > --- a/drivers/power/ab8500_bmdata.c > +++ b/drivers/power/ab8500_bmdata.c > @@ -28,8 +28,10 @@ const struct abx500_res_to_temp ab8500_temp_tbl_a_thermistor[] = { > {60, 13437}, > {65, 12500}, > }; > +EXPORT_SYMBOL(ab8500_temp_tbl_a_thermistor); > Those exports should be in the previous patch where you start exporting the symbols, not in this patch. Thanks, Guenter _______________________________________________ lm-sensors mailing list lm-sensors@xxxxxxxxxxxxxx http://lists.lm-sensors.org/mailman/listinfo/lm-sensors