Philip Pokorny wrote:
Your own experience says that fancontrol, lmsensors and a BMC do not
have a way to coordinate actions which leads to errors and faults.
And as Jean has said, the Winbond chip has a paged register set that
requires coordination to access. The BMC code has now way to
coordinate access with the OS.
Jean mentions thermal trip points. I believe that the winbond chip
includes it's own autonomous fan speed control seperate from the BMC
monitoring. What if you just reprogram the fan control curves in the
Winbond chip once at boot if you don't like the ES BIOS fan control
curve?
I am probably not going to do that because it sounds risky.
Otherwise, no I don't think what you want is possible.
So that's clear now. The solution I have now is also acceptable. (Also,
I did not receive Jean's mail).
How hot were the CPU under full load with the ES fan curve that you
felt they needed to be colder?
Under full CPU load for a longer time, it can get up to 85-90 degrees
Celsius when I use the lowest setting in the motherboard. With maximum
cooling it gets to 72 degrees in such a case. When I use fancontrol I
can make it such that it is around 59 degrees while idle and at most 75
degrees when fully loaded. A temperature of 59 degrees is the
temperature just after it starts up so the minimum temperature. Right
now I am just using a setting which is one higher than the lowest in the
motherboard and that is acceptable, but it will be a bit louder under
idle conditions. Under full load it will get approximately 80 degrees.
Phil P.
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