On 6/26/2013 6:11 PM, Felipe Balbi wrote:
Glue layers are starting to have separate
requirements. For example, OMAP's glue layer
is starting to use extcon framework which
no one else needs.
In order to make it clear the proper dependencies,
we are now allowing glue layers to be selectable
so that each glue layer can list their own dependencies
without messing with the core IP driver.
Signed-off-by: Felipe Balbi <balbi@xxxxxx>
---
Note that this will require defconfig changes unless someone
knows about a choice-like Kconfig construct which allows defaults.
cheers
drivers/usb/dwc3/Kconfig | 29 +++++++++++++++++++++++++++++
drivers/usb/dwc3/Makefile | 13 +++----------
2 files changed, 32 insertions(+), 10 deletions(-)
diff --git a/drivers/usb/dwc3/Kconfig b/drivers/usb/dwc3/Kconfig
index 757aa18..2d12909 100644
--- a/drivers/usb/dwc3/Kconfig
+++ b/drivers/usb/dwc3/Kconfig
@@ -40,6 +40,35 @@ config USB_DWC3_DUAL_ROLE
endchoice
+choice
+ prompt "Platform Glue Driver Support"
+
+config USB_DWC3_OMAP
+ tristate "Texas Instruments OMAP5 and similar Platforms"
+ depends on EXTCON
+ help
+ Some platforms from Texas Instruments like OMAP5, DRA7xxx and
+ AM437x use this IP for USB2/3 functionality.
Do we really need the depends on EXTCON for AM437x and DRA7xx ?
We are using utmi_mode = HW in AM437x.
Regards
-George
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