those two glues are still including <mach/> headers and no active developement has been going on those glues for quite some time. Apparently, for da8xx glue, only initial commit 3ee076de (usb: musb: introduce DA8xx/OMAP-L1x glue layer) has been tested. All other patches seem to have been compile-tested only. For davinci glue layer, last real commit dates back from 2010, with commit f405387 (USB: MUSB: fix kernel WARNING/oops when unloading module in OTG mode). Signed-off-by: Felipe Balbi <balbi@xxxxxx> --- drivers/usb/musb/Kconfig | 2 ++ 1 file changed, 2 insertions(+) diff --git a/drivers/usb/musb/Kconfig b/drivers/usb/musb/Kconfig index dfb57f2..0f1d3e0 100644 --- a/drivers/usb/musb/Kconfig +++ b/drivers/usb/musb/Kconfig @@ -39,10 +39,12 @@ choice config USB_MUSB_DAVINCI tristate "DaVinci" depends on ARCH_DAVINCI_DMx + depends on BROKEN config USB_MUSB_DA8XX tristate "DA8xx/OMAP-L1x" depends on ARCH_DAVINCI_DA8XX + depends on BROKEN config USB_MUSB_TUSB6010 tristate "TUSB6010" -- 1.8.1.rc1.5.g7e0651a -- To unsubscribe from this list: send the line "unsubscribe linux-usb" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
