On Mon, Dec 01, 2014 at 11:10:15AM -0800, Tony Lindgren wrote:
> Commit 82c02f58ba3a ("usb: musb: Allow multiple glue layers to be
> built in") enabled selecting multiple glue layers, which in turn
> exposed things more for randconfig builds. If NOP_USB_XCEIV is
> built-in and TUSB6010 is a loadable module, we will get:
>
> drivers/built-in.o: In function `tusb_remove':
> tusb6010.c:(.text+0x16a817): undefined reference to `usb_phy_generic_unregister'
> drivers/built-in.o: In function `tusb_probe':
> tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register'
> make: *** [vmlinux] Error 1
>
> Let's fix this the same way as commit 70c1ff4b3c86 ("usb: musb:
> tusb-dma can't be built-in if tusb is not").
>
> And while at it, let's not allow selecting the glue layers except
> on platforms really using them unless COMPILE_TEST is specified:
>
> - TUSB6010 is in practise only used on omaps
>
> - DSPS is only used on TI platforms
>
> - UX500 is only used on STE platforms
>
> Cc: Linus Walleij <linus.walleij@xxxxxxxxxx>
> Reported-by: Jim Davis <jim.epost@xxxxxxxxx>
> Signed-off-by: Tony Lindgren <tony@xxxxxxxxxxx>
>
> ---
>
> Felipe, this is against current linux next for v3.19
since this is actually an old bug which just showed up, I'll defer this
to v3.19-rc1.
--
balbi
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