Commit 82c02f58ba3a ("usb: musb: Allow multiple glue layers to be
built in") enabled selecting multiple glue layers, which in turn
exposed things more for randconfig builds. If NOP_USB_XCEIV is
built-in and TUSB6010 is a loadable module, we will get:
drivers/built-in.o: In function `tusb_remove':
tusb6010.c:(.text+0x16a817): undefined reference to `usb_phy_generic_unregister'
drivers/built-in.o: In function `tusb_probe':
tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register'
make: *** [vmlinux] Error 1
Let's fix this the same way as commit 70c1ff4b3c86 ("usb: musb:
tusb-dma can't be built-in if tusb is not").
And while at it, let's not allow selecting the glue layers except
on platforms really using them unless COMPILE_TEST is specified:
- TUSB6010 is in practise only used on omaps
- DSPS is only used on TI platforms
- UX500 is only used on STE platforms
Cc: Linus Walleij <linus.walleij@xxxxxxxxxx>
Reported-by: Jim Davis <jim.epost@xxxxxxxxx>
Signed-off-by: Tony Lindgren <tony@xxxxxxxxxxx>
---
Felipe, this is against current linux next for v3.19
--- a/drivers/usb/musb/Kconfig
+++ b/drivers/usb/musb/Kconfig
@@ -72,6 +72,8 @@ config USB_MUSB_DA8XX
config USB_MUSB_TUSB6010
tristate "TUSB6010"
+ depends on ARCH_OMAP2PLUS || COMPILE_TEST
+ depends on NOP_USB_XCEIV = USB_MUSB_HDRC # both built-in or both modules
config USB_MUSB_OMAP2PLUS
tristate "OMAP2430 and onwards"
@@ -85,6 +87,7 @@ config USB_MUSB_AM35X
config USB_MUSB_DSPS
tristate "TI DSPS platforms"
select USB_MUSB_AM335X_CHILD
+ depends on ARCH_OMAP2PLUS || COMPILE_TEST
depends on OF_IRQ
config USB_MUSB_BLACKFIN
@@ -93,6 +96,7 @@ config USB_MUSB_BLACKFIN
config USB_MUSB_UX500
tristate "Ux500 platforms"
+ depends on ARCH_U8500 || COMPILE_TEST
config USB_MUSB_JZ4740
tristate "JZ4740"
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