Am Mittwoch, 1. März 2023, 21:14:30 CET schrieb Daniel Lezcano: > The thermal zone device structure is exposed to the different drivers > and obviously they access the internals while that should be > restricted to the core thermal code. > > In order to self-encapsulate the thermal core code, we need to prevent > the drivers accessing directly the thermal zone structure and provide > accessor functions to deal with. > > Use the devdata accessor introduced in the previous patch. > > No functional changes intended. > > Signed-off-by: Daniel Lezcano <daniel.lezcano@xxxxxxxxxx> > Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@xxxxxxxxxxxx> #R-Car > Acked-by: Mark Brown <broonie@xxxxxxxxxx> > Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@xxxxxxxxxxxxx> #MediaTek auxadc and lvts > Reviewed-by: Balsam CHIHI <bchihi@xxxxxxxxxxxx> #Mediatek lvts > Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@xxxxxxxxxxxxxx> #da9062 > Reviewed-by: Baolin Wang <baolin.wang@xxxxxxxxxxxxxxxxx> #spread > Acked-by: Jernej Skrabec <jernej.skrabec@xxxxxxxxx> #sun8i_thermal > Acked-by: Rafael J. Wysocki <rafael.j.wysocki@xxxxxxxxx> > Acked-by: Florian Fainelli <f.fainelli@xxxxxxxxx> #Broadcom > Reviewed-by: Dhruva Gole <d-gole@xxxxxx> # K3 bandgap Acked-by: Heiko Stuebner <heiko@xxxxxxxxx> #rockchip
