Re: [PATCH v2 16/21] dt-bindings: spi: document support for SA8255p

[Nikunj Kela <quic_nkela@xxxxxxxxxxx>]

On 9/5/2024 1:04 AM, Krzysztof Kozlowski wrote:
> On 04/09/2024 23:06, Nikunj Kela wrote:
>> On 9/4/2024 9:58 AM, Andrew Lunn wrote:
>>>> Sorry, didn't realize SPI uses different subject format than other
>>>> subsystems. Will fix in v3. Thanks
>>> Each subsystem is free to use its own form. e.g for netdev you will
>>> want the prefix [PATCH net-next v42] net: stmmac: dwmac-qcom-ethqos:
>> of course they are! No one is disputing that.
>>> This is another reason why you should be splitting these patches per
>>> subsystem, and submitting both the DT bindings and the code changes as
>>> a two patch patchset. You can then learn how each subsystem names its
>>> patches.
>> Qualcomm QUPs chips have serial engines that can be configured as
>> UART/I2C/SPI so QUPs changes require to be pushed in one series for all
>> 3 subsystems as they all are dependent.
> No, they are not dependent. They have never been. Look how all other
> upstreaming process worked in the past.

Top level QUP node(patch#18) includes i2c,spi,uart nodes.
soc/qcom/qcom,geni-se.yaml validate those subnodes against respective
yaml. The example that is added in YAML file for QUP node will not find
sa8255p compatibles if all 4 yaml(qup, i2c, spi, serial nodes) are not
included in the same series.


>
> Best regards,
> Krzysztof
>