On Sat, Nov 10, 2018 at 12:25:34PM +0100, Stefan Wahren wrote: > > > +#define BCM2835_SPI_FIFO_SIZE 64 > > > +#define BCM2835_SPI_FIFO_SIZE_3_4 48 > > Not sure if this should not be a DT parameter describing the HW block > > and not being hardcoded in the driver. > I see no reason for this. AFAIK all variants of the BCM2835 have the > same FIFO length, so i'm fine with the defines. I only have doubts > about the naming FIFO_SIZE_3_4 because it describe a fill level not a > size. It's also the sort of thing we should be picking up from the compatible string since we have a per-SoC compatible rather than parameterizing in the DT - that way the SoC just needs the right compatible string in the DT and then new quirks for that SoC don't need DT changes. Please fix your mail client to word wrap within paragraphs at something substantially less than 80 columns. Doing this makes your messages much easier to read and reply to.
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