On 10.08.2024 3:15 AM, Maximilian Luz wrote:
> On 8/10/24 12:44 AM, Konrad Dybcio wrote:
>> On 9.08.2024 8:09 PM, Maximilian Luz wrote:
>>>> +static int ssam_serdev_setup(struct acpi_device *ssh, struct serdev_device *serdev)
>>>> +{
>>>> + if (ssh)
>>>> + return ssam_serdev_setup_via_acpi(serdev, ssh->handle);
>>>> +
>>>> + /* TODO: these values may differ per board/implementation */
>>>> + serdev_device_set_baudrate(serdev, 4 * HZ_PER_MHZ);
>>>
>>> Isn't this defined in the DT spec that you're adding as "current-speed"
>>> in patch 2? Why not load it from there?
>>
>> Yeah and it's not under `required:`.. i added it for future proofing
>
> Okay.
>
> [...]
>
>>>> +static const struct software_node *ssam_node_group_sl7[] = {
>>>> + &ssam_node_root,
>>>> + &ssam_node_bat_ac,
>>>> + &ssam_node_bat_main,
>>>> + &ssam_node_tmp_perf_profile_with_fan,
>>>> + &ssam_node_fan_speed,
>>>> + &ssam_node_hid_sam_keyboard,
>>>
>>> Did you check if there are any other HID devices connected? In the past,
>>> keyboard and touchpad have been split into two separate devices, so is
>>> it a combo keyboard + touchpad device this time? Some models also had
>>> HID-based sensor and other devices.
>>
>> No, touchpad is wired directly to the SoC via QSPI, same for the touch
>> panel
>
> Ah I see. So somewhat similar to the SLS2 I believe. Does it work with
> multiple fingers out-of-the-box? Or does it send raw heatmaps like on
> the SLS2 that require post-processing?
We'll see when the QSPI driver for this soc is done ;)
Konrad
