Hi Kukjin, > Lukasz Majewski wrote: > > > > Hi Kukjin, Eduardo > > > Hi, > > > > On 01/25/15 06:49, Eduardo Valentin wrote: > > > > On Fri, Jan 23, 2015 at 01:09:53PM +0100, Lukasz Majewski wrote: > > > >> 1. Introduction > > > >> > > > >> Following patches aim to clean up the current implementation of > > > >> the thermal framework on Exynos devices. > > > >> > > > >> The main goal was to use a generic code for reading thermal > > > >> configuration (of-thermal.c). Due to that redundant > > > >> exynos_thermal_common.[h|c] files were removed. > > > >> > > > >> Around 400 lines of code (LOC) were removed directly by this > > > >> patch, which is around 20% of the Exynos thermal code base. > > > >> > > > >> This work should NOT bring any functional changes to Exynos > > > >> thermal subsystem. > > > >> > > > >> 2. Patch-set structure > > > >> > > > >> Then the cpu_cooling functionality has been preserved to allow > > > >> cooling devices by reducing operating frequency. Definition of > > > >> trip points and cpufreq's cooling properties were moved to > > > >> device tree. > > > >> > > > >> Then the rework of the way in which configuration data is > > > >> provided to the Exynos thermal subsystem was performed. Now > > > >> device tree is used for configuration. > > > >> > > > >> 3. Dead code removal > > > >> > > > >> Thermal support for some SoCs, previously available in the > > > >> exynos_tmu_data.c file, was removed since, as of (almost) > > > >> 3.19-rc3, they didn't have TMU bindings. > > > >> > > > >> Moreover, support for cpu_cooling devices was preserved only on > > > >> those SoCs which had available and working cpufreq driver. > > > >> > > > >> 4. Testing > > > >> > > > >> Test devices: > > > >> - Exynos4210 - Trats (TMU zone + cpu_cooling) > > > >> - Exynos4412 - Trats2/Odroid U3 (TMU zone + cpu_cooling) > > > >> - Exynos5250 - Arndale (TMU zone + cpu_cooling) > > > >> - Exynos5420 - Arndale-octa (only TMU zones) > > > >> > > > >> Unfortunately, I don't posses Exynos5440 for testing. Its > > > >> functionality has been preserved in the code, but not tested on > > > >> the hardware. I would be grateful for help in testing. > > > >> > > > >> > > > >> 5. This work apply on the following tree: > > > >> > > > >> kernel.org: 'linux-soc-thermal/next' - Eduardo Velentin's tree > > > >> SHA1: 1813d80874699145f04af6b05ebab0a6419001fb > > > >> > > > >> > > > >> Lukasz Majewski (18): > > > > > > > > I have applied the following patches to my -fixes branch (for > > > > next rc cycle) > > > > > > > >> thermal: exynos: cosmetic: Correct comment format > > > >> thermal: exynos: Provide thermal_exynos.h file to be > > > >> included in device tree files > > > >> thermal: exynos: Modify exynos thermal code to use device > > > >> tree for cpu cooling configuration > > > >> cpufreq: exynos: Use device tree to determine if cpufreq > > > >> cooling should be registered > > > >> dts: Documentation: Extending documentation entry for > > > >> exynos-thermal dts: Documentation: Update exynos-thermal.txt > > > >> example for Exynos5440 thermal: samsung: core: Exynos TMU > > > >> rework to use device tree for configuration > > > >> thermal: exynos: Remove exynos_thermal_common.[c|h] files > > > >> thermal: exynos: Remove exynos_tmu_data.c file > > > > > > > > The patches below should go via platform tree: > > > > > > > >> arm: dts: trats: Enable TMU on the Exynos4210 trats device > > > >> arm: dts: odroid: Add LDO10 regulator node necessary for TMU > > > >> on Odroid arm: dts: odroid: Enable TMU at Exynos4412 based > > > >> Odroid U3 device arm: dts: Adding CPU cooling binding for > > > >> Exynos SoCs thermal: exynos: dts: Add default definition of > > > >> the TMU sensor parameter > > > >> thermal: dts: Default trip points definition for Exynos5420 > > > >> SoCs thermal: exynos: dts: Define default thermal-zones for > > > >> Exynos4 thermal: dts: exynos: Trip points and sensor > > > >> configuration data for Exynos5440 > > > >> thermal: exynos: dts: Provide device tree bindings identical > > > >> to the one in exynos_tmu_data.c > > > > > > > > > > I've applied above patches with small subject changes. > > > > > > BTW unfortunately, since missing the > > > "include/dt-bindings/thermal/thermal_exynos.h" in my tree, I > > > couldn't merge it into for-next yet. > > > > As of this writing: (Kernel 4.0-rc1) the > > "include/dt-bindings/thermal/thermal_exynos.h" file is in the kernel > > tree. > > > I know. > > > Kukjin, could you add missing DTS files and send this to upstream. > > > Unfortunately, I couldn't take the DT changes in Samsung tree at that > time because of missing header file and it causes build error. Now I > can pick them into Samsung tree but I'm not sure it can be sent to > upstream during this -rc... > > Eduardo, Lukasz, > Do you guys think the DT changes are really fixes for 4.0? I've created following repository with DTS files: https://github.com/lmajewski/linux-samsung-thermal.git Branch: devel. On top of the v4.0-rc1 tag you will find all necessary patches for fixing thermal regression at Samsung Exynos boards. I hope, that organizing all patches in a separate repository will facilitate and speed up the inclusion process. > > > Thanks in advance. > > > > > > > > Can you please provide a topic branch for it? If not, this cannot > > > be handled in arm-soc tree in this time, I think. > > > > > > - Kukjin > -- Best regards, Lukasz Majewski Samsung R&D Institute Poland (SRPOL) | Linux Platform Group -- To unsubscribe from this list: send the line "unsubscribe linux-samsung-soc" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
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