Hi Tudor, On Mon, Dec 7, 2020 at 5:27 PM <Tudor.Ambarus@xxxxxxxxxxxxx> wrote: > > Hi, Lad, > > On 10/16/20 2:55 PM, Lad Prabhakar wrote: > > EXTERNAL EMAIL: Do not click links or open attachments unless you know the content is safe > > > > This chip is (nearly) identical to the Winbond w25m512jv which is > > already supported by Linux. Compared to the w25m512jv, the 'jw' > > has a different JEDEC ID. > > W25M512JW-IQ (2 x 256M-bit) Serial MCP (Multi Chip Package) Flash memory, > introduces a new “Software Die Select (C2h)” instruction, which we don't > support. I guess you can't access the second die with what we have in > mainline. Or am I wrong? We'll need to add support for multi-die support > if we want to add new multi-die flashes. > My bad, yes only the first die is accessible. I'll post a patch dropping this id. Cheers, Prabhakar
