Hi, Lad, On 10/16/20 2:55 PM, Lad Prabhakar wrote: > EXTERNAL EMAIL: Do not click links or open attachments unless you know the content is safe > > This chip is (nearly) identical to the Winbond w25m512jv which is > already supported by Linux. Compared to the w25m512jv, the 'jw' > has a different JEDEC ID. W25M512JW-IQ (2 x 256M-bit) Serial MCP (Multi Chip Package) Flash memory, introduces a new “Software Die Select (C2h)” instruction, which we don't support. I guess you can't access the second die with what we have in mainline. Or am I wrong? We'll need to add support for multi-die support if we want to add new multi-die flashes. ta
