* Yegor Yefremov <yegorslists@xxxxxxxxxxxxxx> [170112 00:00]: > On Thu, Jan 12, 2017 at 1:47 AM, Tony Lindgren <tony@xxxxxxxxxxx> wrote: > > * Yegor Yefremov <yegorslists@xxxxxxxxxxxxxx> [170111 13:52]: > >> On Wed, Jan 11, 2017 at 3:05 PM, <yegorslists@xxxxxxxxxxxxxx> wrote: > >> > From: Yegor Yefremov <yegorslists@xxxxxxxxxxxxxx> > >> > > >> > This is an attempt to revive DT support for TI HECC that was started in 2015. > >> > > >> > I haven't changed much because not all questions could be fully answered: > >> > > >> > * Should HECC use "am3505" as compatible? > >> > >> I mean "ti,am3505-hecc" > > > > Yeah it should use the device name for the driver. > > > >> > * What should be done to the offsets (ti,scc-ram-offset, ti,hecc-ram-offset, ti,mbx-offset)? > > > > The devicetree maintainers need to ack the binding doc. Maybe > > send that as a first patch? > > The question is whether to place these settings into dtsi (as it was > done in the original patch) or in the driver itself. Well where are they on the SoC? Each driver should only access registers that belong to the driver module. If the ti,scc-ram-offset and ti,hecc-ram-offset are not within the ECC driver module, probably you should use a separate driver for them such as drivers/misc/sram.c. Also, sounds like the ti,mbx-offset should just be using the mailbox framework like remoteproc is doing with include/linux/omap-mailbox.h? Regards, Tony -- To unsubscribe from this list: send the line "unsubscribe linux-omap" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
