* Bin Liu <b-liu@xxxxxx> [160914 06:14]: > On Tue, Sep 13, 2016 at 03:35:05PM -0700, Tony Lindgren wrote: > > * Bin Liu <b-liu@xxxxxx> [160908 11:26]: > > > On Thu, Sep 08, 2016 at 10:45:21AM -0700, Tony Lindgren wrote: > > > > --- a/drivers/usb/musb/Kconfig > > > > +++ b/drivers/usb/musb/Kconfig > > > > @@ -87,7 +87,7 @@ config USB_MUSB_DA8XX > > > > config USB_MUSB_TUSB6010 > > > > tristate "TUSB6010" > > > > depends on HAS_IOMEM > > > > - depends on ARCH_OMAP2PLUS || COMPILE_TEST > > > > + depends on (ARCH_OMAP2PLUS || COMPILE_TEST) && !BLACKFIN > > > > > > Would this cause more issue later when trying to enable all glue drivers > > > in one build? > > > > Yes but see what CONFIG_BLACKFIN is doing with musb_regs.h.. > > It completely redefines all the registers with ifdef else. > > > > > The macros defined in tusb6010.h are only used in tusb6010.c, so how > > > about move '#include "tusb6010.h"' from musb_regs.h to tusb6010.c > > > instead? This gives flexibility to random config test, isn't it? > > > > I'd like to see that but we have this in musb_core.c: > > > > hw_ep->conf = mbase - 0x400 + TUSB_EP0_CONF; > > > > So the build would break there again on blackin with tusb6010.. > > Got any ideas on how to sort that out? > > Thanks for catching it. It appears that the glues require more work to > cleanup. I am taking your patch. OK thanks, yeah still more work needed for the glue layers for sure. Regards, Tony -- To unsubscribe from this list: send the line "unsubscribe linux-omap" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
