Re: [PATCH 0/6] mmc: split the tmio driver into several modules

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Sounds like a good idea... Its possible that I could implement DMA on
the toshiba stuff too, can your code handle this?

(I havent had time to read this yet)

-- 
Ian Molton
Linux, Automotive, and other hacking:
http://www.mnementh.co.uk/



On 11 March 2011 07:51, Guennadi Liakhovetski <g.liakhovetski@xxxxxx> wrote:
> Hi all
>
> The tmio_mmc SD/SDIO driver is serving very different hardware
> configurations: on the one hand multi-function style chips from Toshiba,
> Compaq, on the other hand SDHI units in ARM- and SuperH-based sh-mobile
> SoCs. Apart from the different native APIs: MFD for the former and
> platform-device in the latter, sh-mobile implementations also have a
> number of features, exclusive to them, which, if implemented in the common
> driver, clutter it needlessly and make its maintenance more difficult.
> This patch series simplifies the situation by splitting the driver up into
> 3 modules: the core, consisting of the main part and, on sh-mobile, of the
> DMA part; the mfd glue; and the platform glue. This way also (imaginary)
> sh-mobile systems with additional tmio mfd chips on them can be supported.
>
> Thanks
> Guennadi
> ---
> Guennadi Liakhovetski, Ph.D.
> Freelance Open-Source Software Developer
> http://www.open-technology.de/
>
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