On Sat, 31 Oct 2020 13:40:41 +0000 Jonathan Cameron <jic23@xxxxxxxxxx> wrote: > From: Jonathan Cameron <Jonathan.Cameron@xxxxxxxxxx> > > This set mostly consists of low hanging fruit along the way to converting > all the existing IIO bindings. > > @Rob, I've dropped your Reviewed-by for patch 16 because of the major > change introducing checking on spi-cpol XOR spi-cpha. > It works, but I'm not sure there isn't a more minimal way of doing it. > > I could just have picked up the majority of these, but I forgot to > cc the dt mailing list last time so want to resend them anyway. Applied all but patch 16 where there are questions outstanding. Thanks, Jonathan > > Changes since v1: > * Updated various maintainers to reflect email bounces. > * dht11 - added note on aosong as probably manufacturer > * hoperf,hp03 - fixed description > * ti,dac082s085 > - Family typo > - Put back the reference regulator in example. > - Added checking of XOR of spi-cpha and spi-cpol > * adi,ad7303 - drop adi,use-external-reference from example as no such thing. > > Jonathan Cameron (29): > dt-bindings:iio:humidity:hdc100x Drop separate doc + add to > trivial-devices > dt-bindings:iio:humidity:htu21 Drop separate doc + add to > trivial-devices > dt-bindings:iio:humidity:st,hts221 yaml conversion. > dt-bindings:iio:humidity:dht11 yaml conversion > dt-bindings:iio:pressure:ms5637 Drop separate doc + add to > trivial-devices > dt-bindings:iio:pressure:murata,zpa2326 yaml conversion > dt-bindings:iio:pressure:meas,ms5611 yaml conversion. > dt-bindings:iio:pressure:hoperf,hp03 yaml conversion > dt-bindings:iio:proximity:semtech,sx9500 yaml conversion. > dt-bindings:iio:proximity:st,vl53l0x yaml conversion > dt-bindings:iio:proximity:ams,as3935 yaml conversion > dt-bindings:iio:dac:ti,dac5571 yaml conversion. > dt-bindings:iio:dac:ti,dac7311 yaml conversion > dt-bindings:iio:dac:ti,dac7512 yaml conversion > dt-bindings:iio:dac:ti,dac7612 yaml conversion > dt-bindings:iio:dac:ti,dac082s085 yaml conversion > dt-bindings:iio:dac:adi,ad7303 yaml conversion > dt-bindings:iio:dac:maxim,ds4424 yaml conversion > dt-bindings:iio:dac:fsl,vf610-dac yaml conversion > dt-bindings:iio:dac:microchip,mcp4725 yaml conversion > dt-bindings:iio:dac:maxim,max5821 yaml conversion > dt-bindings:iio:dac:nxp,lpc1850-dac yaml conversion. > dt-bindings:iio:dac:adi,ad5758 yaml conversion > dt-bindings:iio:temperature:melexis,mlx90614 yaml conversion > dt-bindings:iio:temperature:melexis,mlx90632 conversion to yaml > dt-bindings:iio:temperature:meas,tsys01 move to trivial-devices.yaml > dt-bindings:iio:temperature:maxim,max31856 yaml conversion. > dt-bindings:iio:temperature:maxim_thermocouple.txt to > maxim,max31855k.yaml > dt-bindings:iio:temperature:ti,tmp07 yaml conversion > > .../devicetree/bindings/iio/dac/ad5758.txt | 83 ----------- > .../devicetree/bindings/iio/dac/ad7303.txt | 23 ---- > .../bindings/iio/dac/adi,ad5758.yaml | 129 ++++++++++++++++++ > .../bindings/iio/dac/adi,ad7303.yaml | 50 +++++++ > .../devicetree/bindings/iio/dac/ds4424.txt | 20 --- > .../bindings/iio/dac/fsl,vf610-dac.yaml | 55 ++++++++ > .../bindings/iio/dac/lpc1850-dac.txt | 19 --- > .../devicetree/bindings/iio/dac/max5821.txt | 14 -- > .../bindings/iio/dac/maxim,ds4424.yaml | 45 ++++++ > .../bindings/iio/dac/maxim,max5821.yaml | 44 ++++++ > .../devicetree/bindings/iio/dac/mcp4725.txt | 35 ----- > .../bindings/iio/dac/microchip,mcp4725.yaml | 71 ++++++++++ > .../bindings/iio/dac/nxp,lpc1850-dac.yaml | 58 ++++++++ > .../bindings/iio/dac/ti,dac082s085.yaml | 79 +++++++++++ > .../bindings/iio/dac/ti,dac5571.txt | 24 ---- > .../bindings/iio/dac/ti,dac5571.yaml | 52 +++++++ > .../bindings/iio/dac/ti,dac7311.txt | 23 ---- > .../bindings/iio/dac/ti,dac7311.yaml | 49 +++++++ > .../bindings/iio/dac/ti,dac7512.txt | 20 --- > .../bindings/iio/dac/ti,dac7512.yaml | 42 ++++++ > .../bindings/iio/dac/ti,dac7612.txt | 28 ---- > .../bindings/iio/dac/ti,dac7612.yaml | 53 +++++++ > .../bindings/iio/dac/ti-dac082s085.txt | 34 ----- > .../devicetree/bindings/iio/dac/vf610-dac.txt | 20 --- > .../bindings/iio/humidity/dht11.txt | 14 -- > .../bindings/iio/humidity/dht11.yaml | 41 ++++++ > .../bindings/iio/humidity/hdc100x.txt | 17 --- > .../bindings/iio/humidity/hts221.txt | 30 ---- > .../bindings/iio/humidity/htu21.txt | 13 -- > .../bindings/iio/humidity/st,hts221.yaml | 52 +++++++ > .../bindings/iio/pressure/hoperf,hp03.yaml | 47 +++++++ > .../devicetree/bindings/iio/pressure/hp03.txt | 17 --- > .../bindings/iio/pressure/meas,ms5611.yaml | 57 ++++++++ > .../bindings/iio/pressure/ms5611.txt | 19 --- > .../bindings/iio/pressure/ms5637.txt | 17 --- > .../bindings/iio/pressure/murata,zpa2326.yaml | 62 +++++++++ > .../bindings/iio/pressure/zpa2326.txt | 29 ---- > .../bindings/iio/proximity/ams,as3935.yaml | 71 ++++++++++ > .../bindings/iio/proximity/as3935.txt | 34 ----- > .../iio/proximity/semtech,sx9500.yaml | 50 +++++++ > .../bindings/iio/proximity/st,vl53l0x.yaml | 42 ++++++ > .../bindings/iio/proximity/sx9500.txt | 23 ---- > .../bindings/iio/proximity/vl53l0x.txt | 18 --- > .../bindings/iio/temperature/max31856.txt | 24 ---- > .../iio/temperature/maxim,max31855k.yaml | 76 +++++++++++ > .../iio/temperature/maxim,max31856.yaml | 54 ++++++++ > .../iio/temperature/maxim_thermocouple.txt | 24 ---- > .../iio/temperature/melexis,mlx90614.yaml | 50 +++++++ > .../iio/temperature/melexis,mlx90632.yaml | 55 ++++++++ > .../bindings/iio/temperature/mlx90614.txt | 24 ---- > .../bindings/iio/temperature/mlx90632.txt | 28 ---- > .../bindings/iio/temperature/ti,tmp007.yaml | 57 ++++++++ > .../bindings/iio/temperature/tmp007.txt | 33 ----- > .../bindings/iio/temperature/tsys01.txt | 19 --- > .../devicetree/bindings/trivial-devices.yaml | 24 ++++ > 55 files changed, 1465 insertions(+), 726 deletions(-) > delete mode 100644 Documentation/devicetree/bindings/iio/dac/ad5758.txt > delete mode 100644 Documentation/devicetree/bindings/iio/dac/ad7303.txt > create mode 100644 Documentation/devicetree/bindings/iio/dac/adi,ad5758.yaml > create mode 100644 Documentation/devicetree/bindings/iio/dac/adi,ad7303.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/dac/ds4424.txt > create mode 100644 Documentation/devicetree/bindings/iio/dac/fsl,vf610-dac.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/dac/lpc1850-dac.txt > delete mode 100644 Documentation/devicetree/bindings/iio/dac/max5821.txt > create mode 100644 Documentation/devicetree/bindings/iio/dac/maxim,ds4424.yaml > create mode 100644 Documentation/devicetree/bindings/iio/dac/maxim,max5821.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/dac/mcp4725.txt > create mode 100644 Documentation/devicetree/bindings/iio/dac/microchip,mcp4725.yaml > create mode 100644 Documentation/devicetree/bindings/iio/dac/nxp,lpc1850-dac.yaml > create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac082s085.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac5571.txt > create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac5571.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7311.txt > create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7311.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7512.txt > create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7512.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7612.txt > create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7612.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti-dac082s085.txt > delete mode 100644 Documentation/devicetree/bindings/iio/dac/vf610-dac.txt > delete mode 100644 Documentation/devicetree/bindings/iio/humidity/dht11.txt > create mode 100644 Documentation/devicetree/bindings/iio/humidity/dht11.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/humidity/hdc100x.txt > delete mode 100644 Documentation/devicetree/bindings/iio/humidity/hts221.txt > delete mode 100644 Documentation/devicetree/bindings/iio/humidity/htu21.txt > create mode 100644 Documentation/devicetree/bindings/iio/humidity/st,hts221.yaml > create mode 100644 Documentation/devicetree/bindings/iio/pressure/hoperf,hp03.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/pressure/hp03.txt > create mode 100644 Documentation/devicetree/bindings/iio/pressure/meas,ms5611.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/pressure/ms5611.txt > delete mode 100644 Documentation/devicetree/bindings/iio/pressure/ms5637.txt > create mode 100644 Documentation/devicetree/bindings/iio/pressure/murata,zpa2326.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/pressure/zpa2326.txt > create mode 100644 Documentation/devicetree/bindings/iio/proximity/ams,as3935.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/proximity/as3935.txt > create mode 100644 Documentation/devicetree/bindings/iio/proximity/semtech,sx9500.yaml > create mode 100644 Documentation/devicetree/bindings/iio/proximity/st,vl53l0x.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/proximity/sx9500.txt > delete mode 100644 Documentation/devicetree/bindings/iio/proximity/vl53l0x.txt > delete mode 100644 Documentation/devicetree/bindings/iio/temperature/max31856.txt > create mode 100644 Documentation/devicetree/bindings/iio/temperature/maxim,max31855k.yaml > create mode 100644 Documentation/devicetree/bindings/iio/temperature/maxim,max31856.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/temperature/maxim_thermocouple.txt > create mode 100644 Documentation/devicetree/bindings/iio/temperature/melexis,mlx90614.yaml > create mode 100644 Documentation/devicetree/bindings/iio/temperature/melexis,mlx90632.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/temperature/mlx90614.txt > delete mode 100644 Documentation/devicetree/bindings/iio/temperature/mlx90632.txt > create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp007.yaml > delete mode 100644 Documentation/devicetree/bindings/iio/temperature/tmp007.txt > delete mode 100644 Documentation/devicetree/bindings/iio/temperature/tsys01.txt >
