On Tue, 30 Oct 2018 16:44:41 -0500 Rob Herring <robh@xxxxxxxxxx> wrote: > On Sun, Oct 28, 2018 at 06:53:08PM +0000, Jonathan Cameron wrote: > > On Thu, 25 Oct 2018 19:38:12 -0700 > > Martin Kelly <martin@xxxxxxxxxxxxxxxx> wrote: > > > > > From: Martin Kelly <martin@xxxxxxxxxxxxxxxx> > > > > > > Add DT binding documentation for the LSM9DS1 magnetometer driver. > > Bindings are for h/w, not drivers. > > > > > > > Signed-off-by: Martin Kelly <martin@xxxxxxxxxxxxxxxx> > > Given here isn't really an alternative way of doing this (or we > > haven't come up with one yet) in the sensors that are basically multiple > > chips in one package, I'll hope that Rob is happy with the new name > > and apply it. As I'm only pushing out for build tests today I can > > revert or add his Reviewed-by as needed. > > Given only the supplies seem to be shared and those can be handled > correctly with ref counting, separate devices is fine. We do the same > thing for BT/WiFi combo chips with separate host interfaces. > > Reviewed-by: Rob Herring <robh@xxxxxxxxxx> Seems I'd actually failed to apply this last week, so now applied with the message tweaked and Rob's tag. Thanks to both of you, Jonathan > > Rob
