Up to now, each hwmon driver has to implement its own sysfs attributes. This requires a lot of template code, and distracts from the driver's core function to read and write chip registers. To be able to reduce driver complexity, move sensor attribute handling and thermal zone registration into the hwmon core. By using the new API, driver size is typically reduced by 20-50% depending on driver complexity and the number of sysfs attributes supported. The first patch of the series is preparatory; it reorders include files in the hwmon core to make it easier to add or remove individual include files. The second patch of the series introduces the API as well as support for temperature sensor attributes. Subsequent patches introduce support for voltage, current, power, energy, humidity, fan speed, and basic pwm attributes. The series was tested by converting several drivers (lm75, lm90, tmp102, tmp421, ltc4245, nct7904, max31790) to the new API. Testing was done with real chips as well as with the hwmon driver module test code available at https://github.com/groeck/module-tests. v3: - Thermal registration depends on IS_REACHABLE(CONFIG_THERMAL) and CONFIG_THERMAL_OF. v2: - Add patch 1/9 (order include files alphabetically). - Add patch 9/9 (pwm support). - Document callback function parameters of struct hwmon_ops in include/linux/hwmon.h. - Clarify that the is_visible() callback is mandatory. - If an attribute has no template string, treat it as invisible, not as error. Affected are virtual attributes such as HWMON_C_REGISTER_TZ. - Initialize device attribute read/write callback functions unconditionally. - Cosmetic changes, including typo fixes and added newlines for readability. -- To unsubscribe from this list: send the line "unsubscribe linux-iio" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
