On 26/06/16 04:26, Guenter Roeck wrote: > Up to now, each hwmon driver has to implement its own sysfs attributes. > This requires a lot of template code, and distracts from the driver's > core function to read and write chip registers. > > To be able to reduce driver complexity, move sensor attribute handling > and thermal zone registration into the hwmon core. By using the new API, > driver size is typically reduced by 20-50% depending on driver complexity > and the number of sysfs attributes supported. > > The first patch of the series introduces the API as well as support > for temperature sensors. Subsequent patches introduce support for > voltage, current, power, energy, humidity, and fan speed sensors. > > The series was tested by converting several drivers (lm75, lm90, tmp102, > tmp421, ltc4245) to the new API. Testing was done with with real chips > as well as with the hwmon driver module test code available at > https://github.com/groeck/module-tests. Some cool stuff hiding in there :) I've only reviewed 1 and 7 and the intermediate ones are really either correct or they aren't and they look fine to me. So what's next? (beyond presumably a lot of driver conversions). Jonathan > -- > To unsubscribe from this list: send the line "unsubscribe linux-iio" in > the body of a message to majordomo@xxxxxxxxxxxxxxx > More majordomo info at http://vger.kernel.org/majordomo-info.html > -- To unsubscribe from this list: send the line "unsubscribe linux-iio" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
