Up to now, each hwmon driver has to implement its own sysfs attributes. This requires a lot of template code, and distracts from the driver's core function to read and write chip registers. To be able to reduce driver complexity, move sensor attribute handling and thermal zone registration into the hwmon core. By using the new API, driver size is typically reduced by 20-50% depending on driver complexity and the number of sysfs attributes supported. The first patch of the series introduces the API as well as support for temperature sensors. Subsequent patches introduce support for voltage, current, power, energy, humidity, and fan speed sensors. The series was tested by converting several drivers (lm75, lm90, tmp102, tmp421, ltc4245) to the new API. Testing was done with with real chips as well as with the hwmon driver module test code available at https://github.com/groeck/module-tests. -- To unsubscribe from this list: send the line "unsubscribe linux-iio" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
