Hi all, Here is a series splitting up the thermal bindings into 3 separate bindings in YAML, one each of the sensor, cooling-device and the thermal zones. Since I was learning about YAML parsers while creating these bindings, there are bound to be some issues. I have to add that the bindings as they exist today, don't really follow the "describe the hardware" model of devicetree. e.g. the entire thermal-zone binding is a software abstraction to tie arbitrary, board-specific trip points to cooling strategies. This doesn't fit well into the model where the same SoC in two different form-factor devices e.g. mobile and laptop, will have fairly different thermal profiles and might benefit from different trip points and mitigation heuristics. I've started some experiments with moving the thermal zone data to a board-specific platform data that is used to initialise a "thermal zone driver". In any case, if we ever move down that path, it'll probably end up being v2 of the binding, so this series is still relevant. Please help review. Regards, Amit Amit Kucheria (3): dt-bindings: thermal: Add yaml bindings for thermal sensors dt-bindings: thermal: Add yaml bindings for thermal cooling-devices dt-bindings: thermal: Add yaml bindings for thermal zones .../thermal/thermal-cooling-devices.yaml | 114 +++++++ .../bindings/thermal/thermal-sensor.yaml | 70 ++++ .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ 3 files changed, 486 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml -- 2.20.1
