Sigh, typo on my part with the version of the series. Will resend with corrections. On Mon, Feb 24, 2020 at 12:50 PM Amit Kucheria <amit.kucheria@xxxxxxxxxx> wrote: > > Hi all, > > Here is a series splitting up the thermal bindings into 3 separate bindings > in YAML, one each of the sensor, cooling-device and the thermal zones. > Since I was learning about YAML parsers while creating these bindings, > there are bound to be some issues. > > I have to add that the bindings as they exist today, don't really follow > the "describe the hardware" model of devicetree. e.g. the entire > thermal-zone binding is a software abstraction to tie arbitrary, > board-specific trip points to cooling strategies. This doesn't fit well > into the model where the same SoC in two different form-factor devices e.g. > mobile and laptop, will have fairly different thermal profiles and might > benefit from different trip points and mitigation heuristics. I've started > some experiments with moving the thermal zone data to a board-specific > platform data that is used to initialise a "thermal zone driver". > > In any case, if we ever move down that path, it'll probably end up being v2 > of the binding, so this series is still relevant. > > Please help review. > > Regards, > Amit > > > Amit Kucheria (3): > dt-bindings: thermal: Add yaml bindings for thermal sensors > dt-bindings: thermal: Add yaml bindings for thermal cooling-devices > dt-bindings: thermal: Add yaml bindings for thermal zones > > .../thermal/thermal-cooling-devices.yaml | 114 +++++++ > .../bindings/thermal/thermal-sensor.yaml | 70 ++++ > .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ > 3 files changed, 486 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml > create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml > > -- > 2.20.1 >
