On 四, 2012-08-16 at 00:19 -0600, R, Durgadoss wrote:
> Hi Rui,
>
>
> > -----Original Message-----
> > From: Zhang, Rui
> > Sent: Thursday, August 16, 2012 11:44 AM
> > To: R, Durgadoss
> > Cc: lenb@xxxxxxxxxx; rjw@xxxxxxx; linux-acpi@xxxxxxxxxxxxxxx; linux-
> > pm@xxxxxxxxxxxxxxx; eduardo.valentin@xxxxxx; amit.kachhap@xxxxxxxxxx;
> > wni@xxxxxxxxxx
> > Subject: Re: [PATCH 02/13] Thermal: Move thermal_instance to thermal.h
> >
> > On 四, 2012-08-09 at 18:15 +0530, Durgadoss R wrote:
> > > This patch moves the thermal_instance structure
> > > to thermal.h so that thermal management files
> > > (other than thermal_sys.c) can also access it.
> > >
> > > Signed-off-by: Durgadoss R <durgadoss.r@xxxxxxxxx>
> > > ---
> > > drivers/thermal/thermal_sys.c | 21 ---------------------
> > > include/linux/thermal.h | 23 +++++++++++++++++++++++
> > > 2 files changed, 23 insertions(+), 21 deletions(-)
> > >
> > > diff --git a/drivers/thermal/thermal_sys.c b/drivers/thermal/thermal_sys.c
> > > index 5be8728..a0e20f9 100644
> > > --- a/drivers/thermal/thermal_sys.c
> > > +++ b/drivers/thermal/thermal_sys.c
> > > @@ -41,27 +41,6 @@ MODULE_AUTHOR("Zhang Rui");
> > > MODULE_DESCRIPTION("Generic thermal management sysfs support");
> > > MODULE_LICENSE("GPL");
> > >
> > > -#define THERMAL_NO_TARGET -1UL
> > > -/*
> > > - * This structure is used to describe the behavior of
> > > - * a certain cooling device on a certain trip point
> > > - * in a certain thermal zone
> > > - */
> > > -struct thermal_instance {
> > > - int id;
> > > - char name[THERMAL_NAME_LENGTH];
> > > - struct thermal_zone_device *tz;
> > > - struct thermal_cooling_device *cdev;
> > > - int trip;
> > > - unsigned long upper; /* Highest cooling state for this trip point */
> > > - unsigned long lower; /* Lowest cooling state for this trip point */
> > > - unsigned long target; /* expected cooling state */
> > > - char attr_name[THERMAL_NAME_LENGTH];
> > > - struct device_attribute attr;
> > > - struct list_head tz_node; /* node in tz->thermal_instances */
> > > - struct list_head cdev_node; /* node in cdev->thermal_instances */
> > > -};
> > > -
> > > static DEFINE_IDR(thermal_tz_idr);
> > > static DEFINE_IDR(thermal_cdev_idr);
> > > static DEFINE_MUTEX(thermal_idr_lock);
> > > diff --git a/include/linux/thermal.h b/include/linux/thermal.h
> > > index 8611e3e..f25df23 100644
> > > --- a/include/linux/thermal.h
> > > +++ b/include/linux/thermal.h
> > > @@ -33,6 +33,9 @@
> > > #define THERMAL_MAX_TRIPS 12
> > > #define THERMAL_NAME_LENGTH 20
> > >
> > > +/* Initial state of a cooling device during binding */
> > > +#define THERMAL_NO_TARGET -1UL
> > > +
> > > /* No upper/lower limit requirement */
> > > #define THERMAL_NO_LIMIT -1UL
> > >
> > > @@ -164,6 +167,26 @@ struct thermal_zone_device {
> > > struct delayed_work poll_queue;
> > > };
> > >
> > > +/*
> > > + * This structure is used to describe the behavior of
> > > + * a certain cooling device on a certain trip point
> > > + * in a certain thermal zone
> > > + */
> > > +struct thermal_instance {
> > > + int id;
> > > + char name[THERMAL_NAME_LENGTH];
> > > + struct thermal_zone_device *tz;
> > > + struct thermal_cooling_device *cdev;
> > > + int trip;
> > > + unsigned long upper; /* Highest cooling state for this trip point */
> > > + unsigned long lower; /* Lowest cooling state for this trip point */
> > > + unsigned long target; /* expected cooling state */
> > > + char attr_name[THERMAL_NAME_LENGTH];
> > > + struct device_attribute attr;
> > > + struct list_head tz_node; /* node in tz->thermal_instances */
> > > + struct list_head cdev_node; /* node in cdev->thermal_instances */
> > > +};
> > > +
> >
> > as this structure is used internally only, I'm thinking if we can rename
> > drivers/thermal/thermal_sys.c to drivers/thermal/thermal_core.c,
> > and introduce drivers/thermal/thermal_core.h for these internal stuff.
> > what do you think?
>
> Yes agree with you.
> Also, we can keep the sysfs things in thermal_sys.c
> and rest of the things in thermal_core.c, and have a thermal_core.h also.
> (This is how the power supply subsystem does it)
>
> I will include this clean up, as part of v2, if you are Ok with this.
>
yes, please go ahead.
> Other things;
> I was thinking is 'removal of netlink things' from
> thermal_sys.c
and where to move it to?
>
> Removing the hwmon related code (the thermal subsystem has grown
> quite a bit and provides more thermal functionalities than Hwmon)
> So, why do we need CONFIG_HWMON inside thermal subsystem ?
> If all of us agree, I am Ok to remove this also.
>
we need Jean's opinion on this.
But anyway, we can do this at anytime, if really needed.
thanks,
rui
--
To unsubscribe from this list: send the line "unsubscribe linux-acpi" in
the body of a message to majordomo@xxxxxxxxxxxxxxx
More majordomo info at http://vger.kernel.org/majordomo-info.html
