On 10-05-15, 20:07, Nishanth Menon wrote: > just one minor concern being in the SoC end of the world :). In most > times, the current consumption for a specific OPP varies depending on > the specific location in the process node the die is -> this is even > true among a single lot of wafers as well. some SoC vendors use hot, > nominal and cold terminology to indicate the characteristics of the > specific sample. > > it might help state which sample end of the spectrum we are talking > about here. reason being: if I put in values based on my board > measurement, the results may not be similar to what someone else's > sample be. Depending on technology, speed binning strategy used by the > vendor, temperature and few other characteristics, these numbers could > be widely divergent. I don't have any clue about this.. :( @Mark/stephen: Any inputs ? -- To unsubscribe from this list: send the line "unsubscribe devicetree" in the body of a message to majordomo@xxxxxxxxxxxxxxx More majordomo info at http://vger.kernel.org/majordomo-info.html
