On 3.02.2025 9:23 AM, neil.armstrong@xxxxxxxxxx wrote: > On 01/02/2025 16:37, Konrad Dybcio wrote: >> On 29.01.2025 3:41 PM, Neil Armstrong wrote: >>> On 29/01/2025 10:43, Neil Armstrong wrote: >>>> On the SM8650, the dynamic clock and voltage scaling (DCVS) for the GPU >>>> is done from the HLOS, but the GPU can achieve a much higher temperature >>>> before failing according the the reference downstream implementation. >>>> >>>> Set higher temperatures in the GPU trip points corresponding to >>>> the temperatures provided by Qualcomm in the dowstream source, much >>>> closer to the junction temperature and with a higher critical >>>> temperature trip in the case the HLOS DCVS cannot handle the >>>> temperature surge. >>> >>> Since the tsens MAX_THRESHOLD which leads to a system >>> monitor thermal shutdown is set at 120C, I need to lower >>> the critical and hot trip point, so please ignore this patchset. >> >> Should we make the "critical" trip point something like 110 or so? If >> LMH triggers a hard shutdown at 120, the OS will not have any time to >> take action. And 120 sounds like we're pushing it quite hard anyway. > > > My plan is to harmonize and use 110 for hot and 115 for critical, and > if available any passive cooling devices is available at 95C sounds good! Konrad
