On 01/02/2025 16:37, Konrad Dybcio wrote:
On 29.01.2025 3:41 PM, Neil Armstrong wrote:
On 29/01/2025 10:43, Neil Armstrong wrote:
On the SM8650, the dynamic clock and voltage scaling (DCVS) for the GPU
is done from the HLOS, but the GPU can achieve a much higher temperature
before failing according the the reference downstream implementation.
Set higher temperatures in the GPU trip points corresponding to
the temperatures provided by Qualcomm in the dowstream source, much
closer to the junction temperature and with a higher critical
temperature trip in the case the HLOS DCVS cannot handle the
temperature surge.
Since the tsens MAX_THRESHOLD which leads to a system
monitor thermal shutdown is set at 120C, I need to lower
the critical and hot trip point, so please ignore this patchset.
Should we make the "critical" trip point something like 110 or so? If
LMH triggers a hard shutdown at 120, the OS will not have any time to
take action. And 120 sounds like we're pushing it quite hard anyway.
My plan is to harmonize and use 110 for hot and 115 for critical, and
if available any passive cooling devices is available at 95C
Neil
Konrad
