Re: [PATCH] mtd: gpmi: Remove "We support only one NAND chip" from bindings doc

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On Sat, Nov 29, 2014 at 10:40:50AM +0800, Huang Shijie wrote:
> On Fri, Nov 28, 2014 at 08:01:41AM +0100, Stefan Roese wrote:
> > On 28.11.2014 02:48, Huang Shijie wrote:
> > >On Thu, Nov 27, 2014 at 03:18:49PM +0100, Stefan Roese wrote:
> > >>This sentence "We support only one NAND chip now" is not true any more.
> > >>Multiple chips are supported. So lets remove this sentence to not
> > >
> > >The gpmi can only supports one chip. Of course, there are maybe two dies
> > >in this single chip.
> > 
> > Now I'm a bit confused. The i.MX6 supports 4 chips select signals. And isn't
> > "two dies in this single chip" not practically the same as connecting 2 (or
> > more) chips (same device) to multiple chip selects of the SoC? Where is the
> > difference here?
> The "one chip" here is means the "one package" (TSOP or BGA ....).

Then why is this even in the DT binding doc? Isn't that a board-level
constraint (and not a chip property) which should be obvious to the
user? If so, then should we just drop the language? Or at a minimum,
make it more specific so it doesn't confuse readers.

> (In logic, "two dies in this single chip" is same as connecting 2 chips
> to the gpmi.)

...which means that logically, you can connect more than one chip to the
GPMI, right?

Brian
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