Make the MDM9607 thermal sensor support consistent with Qualcomm's vendor kernel (msm-3.18) by applying the correct default slope values and adding "correction factors" to the factory calibration values in the fuses. Use the same functionality to add the very similar MSM8909 SoC to the tsens driver. --- Changes in v4: - Mostly just resend, explicitly initialize zero values for the MSM8909 p1/p2_calib_offset for better clarity (Konrad) - Link to v3: https://lore.kernel.org/r/20230315103950.2679317-1-stephan.gerhold@xxxxxxxxxxxxxxx Changes in v3: - Drop now unused definition reported by kernel test robot Changes in v2: - Rewrite on top of per-sensor nvmem cell changes that landed in 6.3 - Add patches to fix existing support for MDM9607 --- Stephan Gerhold (6): thermal: qcom: tsens: Drop unused legacy structs thermal: qcom: tsens-v0_1: Fix mdm9607 slope values thermal: qcom: tsens-v0_1: Add mdm9607 correction offsets dt-bindings: thermal: qcom-tsens: Drop redundant compatibles dt-bindings: thermal: qcom-tsens: Add MSM8909 compatible thermal: qcom: tsens-v0_1: Add MSM8909 data .../devicetree/bindings/thermal/qcom-tsens.yaml | 23 +---- drivers/thermal/qcom/tsens-v0_1.c | 99 +++++++++++++--------- drivers/thermal/qcom/tsens-v1.c | 22 ----- drivers/thermal/qcom/tsens.c | 19 ++++- drivers/thermal/qcom/tsens.h | 6 +- 5 files changed, 84 insertions(+), 85 deletions(-) --- base-commit: ac9a78681b921877518763ba0e89202254349d1b change-id: 20230508-msm8909-tsens-6733a6d415be Best regards, -- Stephan Gerhold Kernkonzept GmbH at Dresden, Germany, HRB 31129, CEO Dr.-Ing. Michael Hohmuth
